Top Port MEMS Cavity Package and Method of Manufacture Thereof

ABSTRACT

A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application is a divisional of U.S. patent application Ser.No. 14/142,744, entitled “Top Port MEMS Cavity Package and Method ofManufacture Thereof” and filed on Dec. 27, 2013. U.S. Ser. No.14/142,744 is a continuation-in-part of U.S. Pat. No. 8,999,757,entitled “Top Port MEMS Cavity Package and Method of ManufactureThereof” and filed on Mar. 4, 2013. The entire contents of U.S. Ser. No.14/142,744 and U.S. Pat. No. 8,999,757 are incorporated herein byreference.

BACKGROUND OF THE DISCLOSURE

1. Field of the Disclosure

Disclosed is a package to house a Micro-Electro-Mechanical Systemsdevice, and more particularly to a method for manufacture of a top portpackage and the so manufactured package.

2. Description of the Related Art

One Micro-Electro-Mechanical Systems (MEMS) device is an acoustictransducer used in a microphone chip for a personal electronic device(PED). These devices include, but are not limited to, cell phones,laptop computers, tablets and mobile digital devices. One acoustictransducer is disclosed in U.S. Pat. No. 5,870,482 to Loeppert et al.,titled “Miniature Silicon Condenser Microphone.” The acoustic transduceris disclosed as having a frame with a silicon nitride diaphragm bondedto one side of the frame and extending cantilever style over the otherside. A gap between the frame and the diaphragm forms a variable air gapcapacitor. Deflection of the diaphragm by acoustic (sound) waves changesthe gap spacing creating a measurable change in capacitance. U.S. Pat.No. 5,870,482 is incorporated by reference herein in its entirety.

Demands on a package housing a MEMS device are stringent. The devicemust be protected from dirt, dust and mechanical damage. Electricalinterconnection is required to transmit electrical signals between thedevice and other electrical components of the PED. Deflection of thediaphragm is against a fixed volume of air, requiring an air tightcavity adjacent one side of the device. Further, as cell phones andother electrical devices become smaller and more light weight, thepackage housing the MEMS device must contribute to those objectives.Likewise, cost constraints on the product require the package to beinexpensive and preferably not overly complex to assemble.

Representative packages for housing MEMS devices are disclosed in U.S.Pat. No. 8,030,722 to Bolognia et al., titled “Reversible Top/BottomMEMS Package” and in published U.S. Patent Application Publication No.2011/0075875 by Wu et al. that is titled “MEMS Microphone Package.” BothU.S. Pat. No. 8,030,722 and U.S. 2011/0075875 are incorporated byreference herein in their entireties.

U.S. Pat. No. 8,030,722 discloses a package for a MEMS device having abase and a cover formed from a printed circuit board material.Conductive sidewalls electrically interconnect the base and the cover. AMEMS device is mounted to either the base or the cover and wire bondsextending from the MEMS device contact circuit traces on both the coverand the base; electrically interconnecting the MEMS device to both.

U.S. 2011/0075875 discloses a MEMS package having a MEMS device mountedto the package cover. The MEMS device is electrically interconnected tocircuit traces that extend from the cover to conductive sidewalls tocircuit traces formed in the base. An integrated circuit device, such asan amplifier or noise filter is electrically interconnected to thecircuit traces formed in the base.

Top and bottom port packages exist mainly due to the mechanicalrequirements of the end application. Top port packages are oftenpreferred as bottom port packages require a corresponding hole in theapplication PCB to which the microphone is mounted. However, if theratio of air behind the membrane is larger than that in front of it thepackage has improved technical performance particularly regarding signalto noise ratio (larger back volume of air than front volume of air).With a bottom port package where the MEMS die is connected directly tothe package substrate it is easy to get this improved ratio of back tofront volume by mounting the MEMS die over the sound port. For a topport package which many applications mechanically require, it is notpossible with standard packaging to mount the MEMS die in such a way toget the improved technical performance.

There are times when it is desirable to mount the MEMS device to thecover of the package encasing the device. However, forming circuittraces in the cover and electrically conductive sidewalls to transferelectric signals to and from the MEMS device, as in the disclosuresreferenced above, results in a complex package requiring accuratealignment which runs contrary to the objectives to simplify and reducethe cost of such a package. There remains a need for a robust packagethat enables mounting a MEMS device to a cover component of the packagethat does not have the disadvantages of complex assembly and high cost.

BRIEF SUMMARY

Disclosed herein is a method to manufacture a package encasing aMicro-Electro-Mechanical Systems (MEMS) device. The method includes thesteps of: (1) Providing a cover having a lid and sidewalls with a portextending through the lid. (2) Bonding a first base component to thesidewalls thereby defining an internal cavity having surfaces formed bythe lid, the sidewalls and the first base component. This first basecomponent further has an aperture extending therethrough. (3) Insertingthe MEMS device through the aperture and bonding the MEMS device to thelid with the MEMS device at least partially overlapping the port. (4)And bonding a second base component to the first base component to sealthe aperture.

Also disclosed herein is method to manufacture a panel of packages toencase MEMS devices. This method includes the steps of: (1) Providing apanel having a matrix of first base components. Each first basecomponent has an aperture extending there through. (2) Providing a coverfor each first base component member of the matrix. Each cover has a lidand sidewalls with a port extending through the lid. (3) Bonding a firstbase component to the sidewalls thereby defining an internal cavityhaving surfaces formed by the lid, the sidewalls and the first basecomponent. (4) Inserting a MEMS device through each aperture and bondingthat MEMS device to the lid with the MEMS device at least partiallyoverlapping the port. (5) Bonding a second base component to each firstbase component to seal the aperture. (6) And singulating the first panelto form a plurality of packages.

Also disclosed are the packages so produced, which include a coverhaving a lid and sidewalls with a port extending through the lid. Anaperture-containing first base component bonded to the sidewalls. A MEMSdevice bonded to the lid and electrically interconnected to electricallyconductive features disposed on a surface of the first base component. Asecond base component is bonded to the first base component spanning theaperture.

The details of one or more embodiments of the invention are set forth inthe accompanying drawings and the description below. Other features,objects and advantages of the invention will be apparent from thedescription and drawings, and from the claims.

IN THE DRAWINGS

FIG. 1 is a first intermediate assembly in the manufacture of a top portMEMS cavity package in accordance with a first embodiment.

FIG. 2 is a second intermediate assembly in the manufacture of the topport MEMS cavity package in accordance with a first embodiment.

FIG. 3 is a third intermediate assembly in the manufacture of the topport MEMS cavity package in accordance with the first embodiment.

FIG. 4 is the top port MEMS cavity package manufactured in accordancewith the first embodiment.

FIG. 5 is a perspective view of a panel of first base components forused in the manufacture of a plurality of top port MEMS cavity packages.

FIG. 6 is a first intermediate assembly in the manufacture of a top portMEMS cavity package in accordance with a second embodiment.

FIG. 7 is a second intermediate assembly in the manufacture of the topport MEMS cavity package in accordance with the second embodiment.

FIG. 8 is a third intermediate assembly in the manufacture of the topport MEMS cavity package in accordance with the second embodiment.

FIG. 9 is the top port MEMS cavity package manufactured in accordancewith the second embodiment.

FIG. 10 illustrates an alternative substrate for the packages disclosedherein.

FIG. 11 is a first intermediate assembly in the manufacture of a topport MEMS cavity package in accordance with a third embodiment.

FIG. 12 is a second intermediate assembly in the manufacture of the topport MEMS cavity package in accordance with the third embodiment.

FIG. 13 is a third intermediate assembly in the manufacture of the topport MEMS cavity package in accordance with the third embodiment.

FIG. 14 is the top port MEMS cavity package manufactured in accordancewith the third embodiment.

FIG. 15 is a bottom perspective view of a cover for the packagesdisclosed herein.

FIG. 16 is a bottom perspective view of an intermediate assembly for thepackages disclosed herein.

FIG. 17 is a bottom perspective view of an assembled package.

FIG. 18 is a top perspective view of an assembled package.

FIG. 19 is an alternative top port MEMS cavity package manufactured inaccordance with the first embodiment.

FIGS. 20(A)-(B) are schematic side views of an embodiment package havinga circuit device attached therein in a flip chip manner.

FIGS. 21(A)-(B) are schematic side views of an embodiment package havingan embedded circuit device.

FIGS. 22(A)-(B) are schematic side views of an embodiment package havinga passive component attached therein.

FIGS. 23(A)-(B) are schematic side views of an embodiment package havingan embedded passive component.

FIGS. 24(A)-(B) are schematic side views of an embodiment package inwhich a MEMS device is attached in a flip chip manner.

FIGS. 25(A)-(B) are schematic side views of an embodiment package inwhich a MEMS device is attached in a flip chip manner and there is anembedded circuit device.

FIGS. 26(A)-(B) are schematic side views of an embodiment package inwhich a MEMS device is attached in a flip chip manner and there is anattached passive component.

FIGS. 27(A)-(B) are schematic side views of an embodiment package inwhich a MEMS device is attached in a flip chip manner and there is anembedded passive component.

DETAILED DESCRIPTION

FIGS. 1 through 4 illustrate in cross-sectional representation a firstassembly process for the manufacture of a top port MEMS cavity package(reference numeral 100 in FIG. 4). In FIG. 1, a first intermediateassembly 10 includes a cover 12 and a first base component 14. While“cover” and “top” are used interchangeably, it is recognized that thepackage may be flipped over and the cover be the bottom. As such, theword cover should be broadly construed to be the non-substrate side ofthe package.

The cover 12 has a lid 13 and sidewalls 15. A port 16 extends throughthe lid 13 and is sized to permit acoustic waves to interact with a MEMSdevice (reference numeral 18 in FIG. 2). The port 16 may be an opencavity or sealed with a fibrous material or polymer film to protect theMEMS device. The cover 12 is formed from any suitable material such as ametal, ceramic, liquid crystal polymer or other molded polymer. Thefirst base component 14 forms a portion of the substrate (referencenumeral 20 in FIG. 4). The first base component 14 is formed from anelectrical dielectric as is typically used in the manufacture of printedcircuit boards, for example, FR-4 or a ceramic. Wire bond attach sites22 and conductive circuit traces 24 are formed on and in the first basecomponent. A metallized bond pad 26 may be formed on an exterior surface28 of the first base component 14 to facilitate electricalinterconnection to an electrically conductive via 30 formed in a secondbase component 32 (FIG. 4).

Sidewalls 15 of the cover 12 are bonded to first base component 14 withan adhesive 34 or other sealant thereby defining an internal cavity 60having surfaces formed by the lid 13, sidewalls 15 and first basecomponent 14. As electrical interconnection between circuit traces inthe cover 12 and circuit traces in the first base components 14 is notnecessary, adhesive 34 need not be electrically conductive, and ispreferably a dielectric material such as an epoxy, that may be appliedby any suitable process, such as printed, dispensed or dipped. Further,precise alignment of the cover 12 and first base component 14 to aligncircuit traces is not required.

With reference to FIG. 2, a MEMS device 18, such as described in U.S.Pat. No. 5,870,482, is attached to an interior surface 36 of the cover12 by insertion through an aperture 38 that extends through the firstbase component 14. The aperture 38 is sufficiently large to enable theMEMS devise 18 to be inserted there through with sufficient precision toalign the MEMS device over the port 16 to at least partially overlap theport. Accurate insertion may be obtained using standard production dieattach equipment using fiducials and alignment features, such as on thesubstrate 20 shown in FIG. 4 for alignment. The MEMS device is thenbonded, such as with adhesive 40, to the cover 12. Electricalinterconnection between the MEMS device 18 and circuitry, if any, on thecover 12 is not required and the MEMS device is preferably electricallyisolated from the cover 12.

Referring to FIG. 3, bond wires 42 are attached to wire bond sites 44 onthe MEMS device 18. A distance, D, between the exterior surface 28 ofthe first base component 14 and the wire bond sites 44 is on the orderof from 0 to 500 μm, within the capability of a standard wire bondmachines. Opposing ends of the bond wires 42 are bonded to the wire bondattach sites 22.

As shown in FIG. 4, the top port MEMS cavity package 100 is completed bybonding the second base component 32 to the first base component 14sealing aperture 38 to make an air tight seal for internal cavity 60 andto form electrical interconnections.

FIG. 19 illustrates an alternative top port MEMS cavity package 120manufactured in accordance with the first embodiment. In thisalternative, the combined height, H, of the MEMS device 18 and adhesive40 is greater than the length, L, of the sidewalls 45 of the cover 12. Aportion of the MEMS device 18 is accommodated in the aperture 38 of thefirst base component 14. Bond wires 42 fit within a clearance 47 betweenthe first base component 14 and the second base component 32.

While the top port MEMS cavity package 100 may be assembled in singularform as illustrated in FIGS. 1-4, package assembly is particularlyamendable to automated assembly of an array of package units. FIG. 5 isa perspective view of a panel 50 having a matrix of first basecomponents 14, each matrix member having apertures 38 for use in themanufacture of a plurality of top port MEMS cavity packages. Theassembly steps shown in FIGS. 1-4, or other embodiments described below,are performed using either individual covers or a second panel having amatrix of covers for bonding to the matrix of first base components.After insertion and wirebonding of the MEMS devices and other devicecomponents, the package units are singulated by cutting along saw lines52. The second base component may be added to create an air tight sealand electrical interconnection in either panel form, as a third panelbefore singulation, or as individual components subsequent tosingulation. While the panel 50 is illustrated for twelve packages, muchlarger matrices, for example, containing up to 1000 package units may beutilized. A typical panel contains from 75 to 100 units.

FIGS. 6-9 illustrate an assembly process in accordance with a secondembodiment. As shown in FIG. 6, an integrated circuit device 54, such asan amplifier or a noise filter, is attached to a surface 56 of the firstbase component 14 and electrically interconnected to electricallyconductive features, such as conductive traces on a surface 56, of firstbase component 14, such as by wire bonds 58 and also electricallyinterconnected to the MEMS device.

Referring to FIG. 7, cover 12 is then bonded to the first base component14, such as with adhesive 34. Next, as shown in FIG. 8, the MEMS device18 is bonded to interior surface 36 of the cover 12, forming an airtight seal around the port 16. Bond wires 42 electrically interconnectthe MEMS device 18 to wire bond attach sites 22. The package is thencompleted by bonding of second base component 32, as illustrated in FIG.9.

Each MEMS package disclosed herein has an internal cavity 60 thatundergoes changes in volume and pressure when a membrane 62 of the MEMSdevice 18 is displaced by acoustic waves. The volume of this internalcavity 60 may be changed, changing the sensitivity of the package, suchas by addition of a blind cavity 64 formed in the second base component32, as shown in FIG. 10. This blind cavity 64 is aligned with theinternal cavity 60 to be in fluid communication therewith. Attachment ofthe MEMS device 18 requires a seal completely around the base of theMEMS device so that there is no leakage or alternate routes for soundwaves to travel.

FIGS. 11-14 illustrate an assembly process in accordance with a secondembodiment. As shown in FIG. 11, the aperture 38 in the first basecomponent 14 is enlarged to facilitate insertion of both an integratedcircuit device 54 and the MEMS device 18 (FIG. 12). With reference toFIG. 13, wire bond 58 then electrically interconnects the integratedcircuit device 54 and the MEMS device 18. Wire bonds 42 electricallyinterconnect these devices 54, 18 to wire bond attach sites 22 on thefirst base component 14. Second base component 32 then seals the packageforming internal cavity 60. In any of the embodiments herein, secondarycavity 64 may extend over the metallized bond pads 26 to accommodatebond wires 42.

FIG. 15 is a perspective view of the inside of a cover 12 illustratingthe port 16. FIG. 16 is a perspective view of an intermediate assemblyshowing wire bonds 42 extending from an integrated circuit device 54 toconductive circuit traces (not visible) on the first base component 14.The conductive circuit traces terminate at metallized bond pads 26. FIG.17 illustrates the completed package with electrically conductive vias30 extending to an exterior surface of the second base component 32 forproviding electrical interconnection between the enclosed devices andexternal circuitry and devices. FIG. 18 is a top perspective view of theassembled package.

FIGS. 20(A)-(B) illustrate an embodiment package 2001, that in manyrespects is similar to certain other embodiments described above.Circuit device 2002 is connected to first base component 14 in a flipchip manner. Connectors 2003 electrically link circuit device 2002 toconnection points 2004. Connectors 2003 may be any suitable material,such as solder or gold. Connection points 2004 may be metalized pads. Itshould be understood that flip chip connection methods are known tothose of skill in the art to which the present application pertains.Circuit device 2002 becomes disposed within the internal cavity ofpackage 2001 when first base component 14 and sidewalls 15 are bonded.In the production of packages as disclosed in the present application,circuit device 2002 may be attached to first base component 14 in a flipchip manner before the bonding of sidewalls 15 and first base component14. FIG. 20 B illustrates the use of alternate cover 2005.

FIGS. 21(A)-(B) illustrate embodiment package 2101. Second basecomponent 2102 has embedded in it circuit device 2103. Bond wires 2104electrically connect circuit device 2103 to bond wire attachment sites2105. FIG. 21B illustrates the use of alternate cover 2106. In theproduction of packages as disclosed in the present application, circuitdevice 2103 may be embedded prior to assembly of the package 2101.

FIGS. 22(A)-(B) illustrate embodiment package 2201. Passive component2202 is attached to first base component 14. Passive component 2202 isattached in such a manner that it is disposed within the internal cavityof the package when first base component 14 and side walls 15 arebonded. In the production of packages as disclosed in the presentapplication, circuit device 2202 may be attached to first base component14 before the bonding of sidewalls 15 and first base component 14. FIG.22B illustrates the use of alternate cover 2203.

FIGS. 23(A)-(B) illustrate embodiment package 2301. Second basecomponent 2302 has embedded in it passive component 2303. FIG. 23Billustrates the use of alternate cover 2304. In the production ofpackages as disclosed in the present application, passive component 2303may be embedded prior to assembly of the package.

FIGS. 24(A)-(B) illustrate embodiment package 2401. MEMS device 18 isattached to second base component 32 in a flip chip manner. Connectors2402 electronically connect first and second connection points 2403 and2404, respectively, thus electrically connecting MEMS device 18 to firstconnection points 2403. Package 2401 may be produced, in part, byelectrically connecting MEMS device 18 to second base component 32 in aflip chip manner during the step of bonding second base component 32 tofirst base component 14. FIG. 24B illustrates the use of alternate cover2405.

FIGS. 25(A)-(B) illustrate embodiment package 2501. MEMS device 18 isattached to second base component 2502 in a flip chip manner. Circuitdevice 2503 is embedded in second base component 2502. Bond wires 2504electrically connect circuit device 2503 to bond wire connection sites2505. In the production of packages as disclosed in the presentapplication, circuit device 2503 may be embedded prior to assembly ofthe package. FIG. 25B illustrates the use of alternate cover 2506.

FIGS. 26(A)-(B) illustrate embodiment package 2601. MEMS device 18 isattached to second base component 32 in a flip chip manner. Passivecomponent 2602 is attached to first base component 14. Passive component2602 is attached in such a manner that it is disposed within theinternal cavity of the package when first base component 14 and sidewalls 15 are bonded. In the production of packages as disclosed in thepresent application, passive component 2602 may be attached to firstbase component 14 before the bonding of sidewalls 15 and first basecomponent 14. FIG. 26B illustrates the use of alternate cover 2603.

FIGS. 27(A)-(B) illustrate embodiment package 2701. MEMS device 18 isattached to second base component 2702 in a flip chip manner. Secondbase component 2702 has embedded in it passive component 2703. FIG. 27Billustrates the use of alternate cover 2704. In the production ofpackages as disclosed in the present application, passive component 2703may be embedded prior to assembly of the package.

One or more embodiments of the present invention have been described.Nevertheless, it will be understood that various modifications may bemade without departing from the spirit and scope of the invention.Accordingly, other embodiments are within the scope of the followingclaims.

We claim:
 1. A package for housing a Micro-Electro-Mechanical Systems(MEMS) device, comprising: a cover having a lid and sidewalls with aport extending through the lid; a first base component having anaperture extending therethrough and bonded to said sidewalls; a MEMSdevice bonded to said lid and electrically interconnected toelectrically conductive features disposed on a surface of said firstbase component; and a second base component bonded to said first basecomponent spanning said aperture.
 2. The package of claim 1 wherein acircuit device is disposed within said package and attached to saidfirst base component in a flip chip manner.
 3. The package of claim 1wherein a circuit device is embedded within said second base component.4. The package of claim 1 wherein a passive component is disposed withinsaid package and attached to said first base component.
 5. The packageof claim 1 wherein a passive component is embedded within said secondbase component.
 6. A package for housing a MEMS device, comprising: acover having a lid and sidewalls with a port extending through the lid;a first base component having an aperture extending therethrough andbonded to said sidewalls; a second base component bonded to said firstbase component spanning said aperture; a MEMS device bonded to said lidand electrically interconnected to said second base component in a flipchip manner.
 7. The package of claim 6 wherein a circuit device isembedded within said second base component.
 8. The package of claim 6wherein a passive component is disposed within said package and attachedto said first base component.
 9. The package of claim 6 wherein apassive component is embedded within said second base component.
 10. Apackage for housing a MEMS device, comprising: a cover having a lid andsidewalls with a port extending through the lid; a base component bondedto said sidewalls; a circuit device disposed within said package andattached to said first base component in a flip chip manner; a MEMSdevice bonded to said lid and electrically interconnected to the circuitdevice.